Unrivaled GPU Systems: Deep Learning-Optimized Servers for the Modern Data Center

NVIDIA GB300 NVL72
Liquid Cooled Rack-Scale Solution with 72 NVIDIA B300 GPUs and 36 Grace CPUs
GPU: 72 NVIDIA B300 GPUs via NVIDIA Grace Blackwell Superchips
CPU: 36 NVIDIA Grace CPUs via NVIDIA Grace Blackwell Superchips
Memory: Up to 21 TB HBM3e (GPU Memory), Up to 17 TB LPDDR5X (System Memory)
Drives: up to 144 E1.S PCIe 5.0 drive bays

Liquid-Cooled Universal GPU Systems
Direct-to-chip liquid-cooled systems for high-density AI infrastructure at scale.
GPU: NVIDIA HGX B300/B200/H200
CPU: Intel® Xeon® or AMD EPYC™
Memory: Up to 32 DIMMs, 9TB
Drives: Up to 24 Hot-swap U.2 or 2.5″ NVMe/SATA drives

Universal GPU Systems
Modular Building Block Design, Future Proof Open-Standards Based Platform in 4U, 5U, 8U, or 10U for Large Scale AI training and HPC Applications
GPU: NVIDIA HGX B300/B200/H200, AMD Instinct MI350 Series and MI325X/MI300X/MI250 OAM Accelerator, Intel Data Center GPU Max Series
CPU: Intel® Xeon® or AMD EPYC™
Memory: Up to 32 DIMMs, 9TB
Drives: Up to 24 Hot-swap E1.S, U.2 or 2.5″ NVMe/SATA drives

3U/4U/5U GPU Lines with PCIe 5.0
Maximum Acceleration and Flexibility for AI, Deep Learning and HPC Applications
GPU: Up to 10 NVIDIA H100 PCIe GPUs, or up to 10 double-width PCIe GPUs
CPU: Intel® Xeon® or AMD EPYC™
Memory: Up to 32 DIMMs, 9TB or 12TB
Drives: Up to 24 Hot-swap 2.5″ SATA/SAS/NVMe

NVIDIA MGX™ Systems
Modular Building Block Platform Supporting Today's and Future GPUs, CPUs, and DPUs
GPU: Up to 4 NVIDIA PCIe GPUs including NVIDIA RTX PRO™ 6000 Blackwell Server Edition, H200 NVL, H100 NVL, and L40S
CPU: NVIDIA GH200 Grace Hopper™ Superchip, Grace™ CPU Superchip, or Intel® Xeon®
Memory: Up to 960GB ingegrated LPDDR5X memory (Grace Hopper or Grace CPU Superchip) or 16 DIMMs, up to 4TB DRAM (Intel)
Drives: Up to 8 E1.S + 4 M.2 drives

AMD APU Systems
Multi-processor system combining CPU and GPU, Designed for the Convergence of AI and HPC
GPU: 4 AMD Instinct MI300A Accelerated Processing Unit (APU)
CPU: AMD Instinct™ MI300A Accelerated Processing Unit (APU)
Memory: Up to 512GB integrated HBM3 memory (4x 128GB)
Drives: Up to 8 2.5″ NVMe or Optional 24 2.5″ SATA/SAS via storage add-on card + 2 M.2 drives

4U GPU Lines with PCIe 4.0
Flexible Design for AI and Graphically Intensive Workloads, Supporting Up to 10 GPUs
GPU: NVIDIA HGX A100 8-GPU with NVLink, or up to 10 double-width PCIe GPUs
CPU: Intel® Xeon® or AMD EPYC™
Memory: Up to 32 DIMMs, 8TB DRAM or 12TB DRAM + PMem
Drives: Up to 24 Hot-swap 2.5″ SATA/SAS/NVMe

2U 2-Node Multi-GPU with PCIe 4.0
Dense and Resource-saving Multi-GPU Architecture for Cloud-Scale Data Center Applications
GPU: Up to 3 double-width PCIe GPUs per node
CPU: Intel® Xeon® or AMD EPYC™
Memory: Up to 8 DIMMs, 2TB per node
Drives: Up to 2 front hot-swap 2.5” U.2 per node

GPU Workstation
Flexible Solution for AI/Deep Learning Practitioners and High-end Graphics Professionals
GPU: Up to 4 double-width PCIe GPUs
CPU: Intel® Xeon®
Memory: Up to 16 DIMMs, 6TB
Drives: Up to 8 hot-swap 2.5” SATA/NVMe